Thermal Management Grade CVD
Overview
Diamond has thermal conductivity five times that of copper while being an electrical insulator, making it the perfect heat sink material. The unsurpassed thermal conductivity combined with high electrical resistivity enables increased microprocessor frequency, higher output power delivery, smaller device dimensions, and extended component lifetimes.
Key Features
Available Variants
Polycrystalline
| Size | Thickness | Carat Weight |
|---|---|---|
| 10.0 × 10.0 mm | 0.25 mm | 0.43 ct |
| 10.0 × 10.0 mm | 0.50 mm | 0.85 ct |
Need a custom size or bulk order? Contact us for a quote.
Applications
RF Power Devices
Radio frequency components requiring efficient heat management
Power Semiconductors
High-power electronic components with thermal challenges
High Speed Processors
Computing chips requiring superior cooling solutions
Radar Amplifiers
Defense and aerospace radar system components
High-Power Laser Diode Arrays
Laser systems requiring efficient thermal management
LEDs
High-brightness LED applications needing heat dissipation
Specifications
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